“Back Flap” insulator panel for B2A-PCB-XX and B2C-PCB-XX terminals.

Purpose: Prevents accidental wire penetration making direct contact with components on the PCB behind the terminal. If a wire is stripped too long and pushes through the back of the wire hole of the terminal, the tough and highly insulating “Back Flap” prevents the wire making electrical contact with another conducting component by providing a barrier between the two.

Construction: Made from “Nomex” 410 Aramid fiber0.01 inch thick (0.25mm) with integral slot for attachment to the terminal bus prior to soldering. Heat proof Aramid fiber is wave solderable and comes with remarkable electrical properties. UL Listing if source material. Nomex 410 retains its useful properties after exposure to 250 C soldering temperatures. Nomex 410 will not support combustion at operating temperatures under 240C.

Common industrial solvents (alcohols, ketones, acetone, toluene, xylene) have a slight softening and swelling effect on NOMEX^® Type 410 paper, similar to that of water. These effects are mainly reversible when the solvent is removed.